Fully automatic
High precision
This product is a non-contact thickness measurement device. It is a quality management device for the growth of Fine Pitch process capabilities, the improvement of printing technology and precision requirements. It can also provide various SPC statistical analysis values to improve process capabilities.
Features:
1. Automatic/manual measurement of solder paste thickness.
2. Manual measurement of paste length, width and spacing.
3. Automatic calculation of solder paste area, cross-sectional area and volume.
4. The measured values can be recorded, archived and printed.
5. Capture images taken by CCD and store images.
6. Automatic calculation of process capability indicators Cp, Cpk and Cpm.
7. Provide thickness distribution diagram and X-Bar/R-BAR control diagram.
8. Can measure and record separately according to different production lines at the same time.
9. Quickly adjust the focus according to the basic thickness measurement.
10. Can call sampling at a fixed time.
Scope of application
1. Printing surface of tin copper foil.
2. Various thickness measurement values: obtain analysis statistics.
