Zhimao PCB splitter manufacturer shares: Solution to film deformation in PCB copying process
1. Splicing method: This method is suitable for films with less dense circuits and inconsistent deformation of each layer of film, and is particularly effective for the correction of solder mask films and multi-layer board power supply layer films. Specific operation: Cut the deformed part of the film, re-splice it according to the hole position of the drilling test board, and then copy it. Of course, this is for graphics with simple deformed circuits, large line width and spacing, and irregular deformation; it is not applicable to films with high wire density and line width and spacing less than 0.2mm.
Warm reminder: When splicing, pay attention to minimizing the damage to the wires and pads. When revising the version after splicing and copying, pay attention to the correctness of the connection relationship.
2. PCB copying method of changing hole position: This method is suitable for films with dense circuits or corrections of consistent deformation of each layer of film. Specific operation: first compare the film and the drilling test board, measure and record the length and width of the drilling test board respectively, and then adjust the hole position on the digital programmer according to the size of the two deformations of length and width, and adjust the drilling test board to cater to the deformed film. The advantage of this method is that it eliminates the tedious work of editing the film and can ensure the integrity and accuracy of the graphics. The disadvantage is that the correction of the film with very serious local deformation and uneven deformation is not effective.
Warm reminder: To use this method, you must first master the operation of the digital programmer. After using the programmer to lengthen or shorten the hole position, the hole position that exceeds the tolerance should be reset to ensure accuracy.
3. Pad overlap method: This method is suitable for films with line width and spacing greater than 0.30mm and not too dense graphic circuits. Specific operation: Enlarge the holes on the test board into pads to overlap the deformed circuit pieces to ensure the minimum ring width technical requirements.
Warm reminder: After overlapping copying, the pad is elliptical, and after overlapping copying, the halo and deformation of the edge of the line and disk. If the user has very strict requirements on the appearance of the PCB board, please use it with caution.
4. Photography method: This method is only applicable to silver salt film. It can be used when it is inconvenient to re-drill the test board and the deformation ratio of the length and width of the film is consistent. The operation is also very simple: just use the camera to enlarge or reduce the deformed graphics.
Warm reminder: Usually the film loss is large, and multiple debugging is required to obtain a satisfactory circuit graphic. Focus accurately when taking pictures to prevent line deformation.
5. Hanging method: This method is suitable for films that have not yet been deformed, and can also prevent the film from deforming after copying. Specific operation: Take it out of the sealed bag before copying the film, and hang it in the working environment for 4-8 hours. Let the film deform before copying, then after copying, the probability of deformation is very small. For deformed films, other methods need to be taken.
Warm reminder: Because the film will change with the changes in ambient temperature and humidity, when hanging the film, make sure that the humidity and temperature of the hanging place are consistent with the working place, and it must be in a ventilated and dark environment to prevent the film from being contaminated.
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